Copper Foil


Frequently used in High End market of Multilayer PCI the Copper Foils and Copper – Aluminum – Copper are electroformed in rotational titanium barrels, exclusive for Copper Foil deposit, obtaining a high quality surface. The deposited surface is submitted to a series of treatment operations, that way making different products for a variety of requisites for its final use. Meanwhile the treatment copper detritus are deposited over the surface to enhance the resin fixation above the lamination's B stage, as other copper layer is deposited to promote trustworthy in technical applications.


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